IBM and SAP Drive Innovation: Unleashing Generative AI Solutions and Expanding Chiplet Technology with Rapidus

5 giu 2024 · 6 min. 8 sec.

Descrizione

IBM and SAP are enhancing business and industry value through new generative AI solutions. Additionally, Rapidus is expanding its collaboration with IBM to develop chiplet packaging technology for 2nm-generation semiconductors.

Commenti

Accedi per lasciare un commento

Informazioni

Autore	Spod Media LLC
Sito	-
Tag	#2nm-generation #ai solutions #ai technology #business technology #business value #chip technology #chiplet packaging #collaboration #cutting-edge technology #enterprise solutions #generative ai #ibm #industry value #packaging technology #rapidus #sap #semiconductor technology #semiconductors #technology innovation #technology partnership

Termini
Privacy
Gestisci cookie

IBM and SAP Drive Innovation: Unleashing Generative AI Solutions and Expanding Chiplet Technology with Rapidus

Scarica e ascolta ovunque

Incorpora episodio

Descrizione

Commenti

Informazioni

Sembra che non tu non abbia alcun episodio attivo

Corrente

Sembra che non ci sia nessun episodio nella tua coda

Successivo