Episode 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
24 nov 2020 ·
50 min. 9 sec.
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Descrizione
Episode 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts Voiding is the cause of multiple failure mechanisms. I spoke with solder material expert Tim O'Neill...
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Episode 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
Voiding is the cause of multiple failure mechanisms. I spoke with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.
My guests may be reached here:
Tim O'Neill
Aim Solder
toneill@aimsolder.com
www.aimsolder.com
Prakash Gango
StenTech
prakash@stentech.com
www.stentech.com
Kalyan Nukala
Kalyan.Nukala@zestronusa.com
www.zestron.com
mostra meno
Voiding is the cause of multiple failure mechanisms. I spoke with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.
My guests may be reached here:
Tim O'Neill
Aim Solder
toneill@aimsolder.com
www.aimsolder.com
Prakash Gango
StenTech
prakash@stentech.com
www.stentech.com
Kalyan Nukala
Kalyan.Nukala@zestronusa.com
www.zestron.com
Informazioni
| Autore | Reliability Matters |
| Organizzazione | Reliability Matters |
| Sito | - |
| Tag |
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