Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction
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Descrizione
Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction Greg and Tony talk to me about stencil design and how to reduce voiding....
mostra di piùGreg and Tony talk to me about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper entitled "Root Cause Stencil Design for SMT Component Thermal Lands"
Download here: https://tinyurl.com/szx3xt8
Greg Smith can be reached here: gsmith@blueringstencils.com
Tony Lentz can be reached here: tlentz@fctassembly.com
Informazioni
Autore | Reliability Matters |
Sito | - |
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